REFLOW OVENS

A reflow oven is a machine used primarily for reflow soldering of SMD components on the PCB. The oven usually contains multiple zones, which can be individually controlled for temperature. We offer reflow ovens in up to 12 zones. Our range varies from bench top batch solder reflow oven to automatic floor style systems. For reflow ovens, we represent Essemtec AG (Switzerland) and Exelsius (France)

FULL CONVECTION REFLOW OVENS

  • The requirements for a modern furnace are in soldering and gluing and in zone control, the storage of profiles, and the air circulation volume – for complex circuit boards.
  • The ovens of the RO series offer pure convection technology to solder the circuit boards evenly and gently.
  • 400 mm process and circuit board width, integrated microprocessor control for zone control, and temperature measurement in the heating zones almost at circuit board height ensure very well, simple repeatability of the soldering profiles.

RO300FC

  • Apropriate for Prototyping and volume production
  • High tech engineering for a maximum in flexibility and quality
  • Perfect soldering results
  • RO-Control
  • Full convection heating
  • Small footprint
  • High troughput
  • Equal heating rates
  • Integrated microprocessor control
  • Uniform heating
  • With or without Nitrogen
  • Transport choices
  • Easy integration
  • Process control
  • Easy to maintain
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RO400FC

  • The RO400FC – easy operation
  • High tech engineering for a maximum in fl exibility and quality
  • Perfect soldering results
  • RO-Control
  • Full convection heating
  • 400 mm process width,
  • High air volume for low thermal stress plus efficient heat transfer
  • Closed loop controlled conveyor drive system and built-in overheat security switches
  • Transport system choices
  • Easy integration
  • Uniform heating
  • Efficient cooling
  • Process control

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